PVD Coating Technology

PVD(Physical Vapor Deposition) describes as ionizing of gas and vaporized material formed from metallic plate material and sticking onto various workpiece which forms a 1-10um super hard film by adopting electric arc discharge technology with low voltage and high current performed under vacuum conditions. It is a vacuum-sealing filming with no contamination. This PVD solution can easily acquire ceramic coating and composite coating with super hardness and wear-resistance while others hardly can achieve. PVD coating used in cutting tools, molds can lengthen life exponentially which leads to the realization of high-yields but low-cost. Moreover, PVD coating technology supports a relatively low temperature which ensures coating onto most workpiece.


Splitting arc: 400A arc splitting technology(utilization rate of target:60%)


Traditional arc:200A, punchy control of magnetic arc(utilization rate of target:30%)

 

Comparison of micro-structure
Surface roughness of coating

Splitting arc

*100 under microscope

Traditional arc

*100 under microscope
Rough coating

Droplet status(bulgy surface) After polishing(Sunken surface)

Advantages :

Advantages :

Super-hard coating

High-rigid

Optimum adhesive force

High density coating

Disadvantages :

Rough

Droplet

Suitable for 3D

High-deposition rate

Economical

Smooth coating

Large color variation

Aiming at 2D

Disadvantages :

Low deposition rate

Adhesion is general

Low hardness(columnar)


Splitting arc

Excellent adhesion

Arc & Sputter Splitting arc :
Target : AlTi =60/40 at.%
Thickness= 1.5μm
Hardness= 3,300HV

Sputter :
Target : AlTi =60/40 at.%
Thickness= 1.5μm
Hardness= 2,000HV

Coating structure

Single-layer coating
Gradient coating
Multi-layer composite coating
Multi-layer nano composite coating